New 512Mb (x8 and x16) DDR3 and DDR3L SDRAMs

The News: Alliance Memory announces that it has expanded the industry’s widest offering of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs with new 512Mb, x8 and x16 devices in the 78-ball and 96-ball FBGA packages, respectively.

Part Numbers: AS4C32M16D3-12BCN, AS4C32M16D3-12BIN, AS4C32M16D3L-12BCN, AS4C32M16D3L-12BIN, AS4C64M8D3-12BCN, AS4C64M8D3-12BIN, AS4C64M8D3L-12BCN, AS4C64M8D3L-12BIN

Availability: Samples of the new 512Mb DDR3 and DDR3L SDRAMs are available now. Production quantities will be available in October 2017, with lead times to eight weeks.

Key Specifications and Benefits:
64Mb x8 and 32Mb x16 configurations

• Available in 78-ball and 96-ball FBGA packages
• Extremely fast transfer rates of 1600Mbps and clock rates of 800MHz
• Single power supply:
  • DDR3 SDRAMs: +1.5V (±0.075V)
  • DDR3L SDRAMs: +1.35V, with backward compatibility to 1.5V
  • JEDEC-compliant
• Available in commercial-extended (0℃ to +95℃) and industrial (-40℃ to +95℃) temperature ranges
• Support sequential and interleave burst types with read or write burst lengths of 4 or 8
• Auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence
• Easy-to-use refresh functions include auto- or self-refresh
• RoHS-compliant, lead (Pb)- and halogen-free

Target Applications:

• Graphics cards
• DIMM modules
• Embedded systems
• Desktop and notebook computers
• Industrial metering applications
• Consumer electronics
• Wireless base stations