Alliance Memory

What's New

June 26, 2014

Alliance Memory Launches New High-Speed CMOS DDR3 SDRAMs With 1-Gb, 2-Gb, and 4-Gb Densities in 78-Ball and 96-Ball FBGA Packages

SAN CARLOS, Calif. — June 26, 2014 — Alliance Memory today introduced a new line of high-speed CMOS double data rate 3 synchronous DRAMs (DDR3 SDRAM) and low-voltage DDR3L SDRAMs with densities of 1 Gb, 2 Gb, and 4 Gb in 78-ball 9 mm by 10.5 mm by 1.2 mm and 96-ball 9 mm by 13 mm by 1.2 mm FBGA packages. With their double data rate architecture, the devices released today offer extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.

With minimal die shrinks, the company’s DDR3 (1.5 V) and DDR3L (1.35 V) SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, consumer, and telecom applications — eliminating the need for costly redesigns and part requalification.

The AS4C64M16D3, AS4C128M8D3, AS4C128M16D3, AS4C256M8D3, AS4C256M16D3, and AS4C512M8D3 DDR3 SDRAMs operate from a single +1.5-V (±0.075 V) power supply, while the AS4C64M16D3L, AS4C128M8D3L, AS4C128M16D3L, AS4C256M8D3L, AS4C256M16D3L, and AS4C512M8D3L DDR3L SDRAMs operate from a single +1.35-V power supply. The devices are offered with a commercial temperature range of 0 °C to +95 °C and an industrial temperature range of -40 °C to +95 °C.

The DDR3 and DDR3L SDRAMs are internally configured as eight banks of 64M, 128M, 256M, and 512M x 8 bits and/or 16 bits. The devices offer fully synchronous operation and provide programmable read or write burst lengths of 4 or 8. An auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, and a programmable mode register allows the system to choose the most suitable modes to maximize performance. RoHS-compliant, the devices are lead (Pb)- and halogen-free.

Part # Density Power supply Configuration Temp. range FBGA Pkg.
AS4C64M16D3-12BCN 1 Gb +1.5 V 64M x 16 bit 0 °C to +95 °C 96-ball
AS4C64M16D3-12BIN 1 Gb +1.5 V 64M x 16 bit -40 °C to +95 °C 96-ball
AS4C128M8D3-12BCN 1 Gb +1.5 V 128M x 8 bit 0 °C to +95 °C 78-ball
AS4C128M8D3-12BIN 1 Gb +1.5 V 128M x 8 bit -40 °C to +95 °C 78-ball
AS4C128M16D3-12BCN 2 Gb +1.5 V 128M x 16 bit 0 °C to +95 °C 96-ball
AS4C128M16D3-12BIN 2 Gb +1.5 V 128M x 16 bit -40 °C to +95 °C 96-ball
AS4C256M8D3-12BCN 2 Gb +1.5 V 256M x 8 bit 0 °C to +95 °C 78-ball
AS4C256M8D3-12BIN 2 Gb +1.5 V 256M x 8 bit -40 °C to +95 °C 78-ball
AS4C256M16D3-12BCN 4 Gb +1.5 V 256M x 16 bit 0 °C to +95 °C 96-ball
AS4C256M16D3-12BIN 4 Gb +1.5 V 256M x 16 bit -40 °C to +95 °C 96-ball
AS4C512M8D3-12BCN 4 Gb +1.5 V 512M x 8 bit 0 °C to +95 °C 78-ball
AS4C512M8D3-12BIN 4 Gb +1.5 V 512M x 8 bit -40 °C to +95 °C 78-ball
AS4C64M16D3L-12BCN 1 GB +1.35 V 64M x 16 bit 0 °C to +95 °C 96-ball
AS4C64M16D3L-12BIN 1 GB +1.35 V 64M x 16 bit -40 °C to +95 °C 96-ball
AS4C128M8D3L-12BCN 1 GB +1.35 V 128M x 8 bit 0 °C to +95 °C 78-ball
AS4C128M8D3L-12BIN 1 GB +1.35 V 128M x 8 bit -40 °C to +95 °C 78-ball
AS4C128M16D3L-12BCN 2 Gb +1.35 V 128M x 16 bit 0 °C to +95 °C 96-ball
AS4C128M16D3L-12BIN 2 Gb +1.35 V 128M x 16 bit -40 °C to +95 °C 96-ball
AS4C256M8D3L-12BCN 2 Gb +1.35 V 256M x 8 bit 0 °C to +95 °C 78-ball
AS4C256M8D3L-12BIN 2 Gb +1.35 V 256M x 8 bit -40 °C to +95 °C 78-ball
AS4C256M16D3L-12BCN 4 Gb +1.35 V 256M x 16 bit 0 °C to +95 °C 96-ball
AS4C256M16D3L-12BIN 4 Gb +1.35 V 256M x 16 bit -40 °C to +95 °C 96-ball
AS4C512M8D3L-12BCN 4 Gb +1.35 V 512M x 8 bit 0 °C to +95 °C 78-ball
AS4C512M8D3L-12BIN 4 Gb +1.35 V 512M x 8 bit -40 °C to +95 °C 78-ball

Samples of the new DDR3 and DDR3L SDRAMs are available now, with lead times of six to eight weeks for production quantities. Pricing for U.S. delivery starts at $2.00 per piece in 1,000-piece quantities.

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