Alliance Memory to Highlight SRAM and DRAM Memory ICs for Legacy and New Designs at Embedded World

SAN CARLOS, Calif. — Feb. 8, 2018 — Alliance Memory today announced it will be displaying its line of legacy SRAM, DRAM, and SDRAM ICs at Embedded World 2018 within the Avnet Silica booth in Hall 1, 1-370, Feb. 27 – March 1 at the Nuremberg, Germany Exhibition Centre.

Alliance Memory’s products, which are aimed at both legacy and new designs, include high-speed synchronous DRAMs (SDRAM) and mobile low-power DDR and DDR2 devices featuring a wide range of densities, configurations, package options, and temperature ratings

Alliance Memory’s ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, automotive, medical, communications, telecom, and consumer electronics products requiring high memory bandwidth, and they are particularly well-suited to high-performance PC applications. The devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company performs minimal or no die shrinks, which frees up engineering resources.

“We look forward to meeting with our distributors and customers at Embedded World,” said Sue Macedo, Alliance Memory’s EMEA managing director. “Alliance Memory has its highest market share in Europe, so we particularly value the opportunity to be a part of this key trade show for the EMEA market.”

Alliance Memory President and CEO David Bagby will also be attending Embedded World. To request an appointment with Mr. Bagby or Ms. Macedo, please send an email to sue[at]alliancememory.com.