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Alliance Memory

Manufacturer of Legacy Memory SRAM, DRAM, and Flash ICs

June 23, 2016

Alliance Memory Launches New 256M High-Speed CMOS SDRAMs in the 86-Pin TSOP II Package

SAN CARLOS, Calif. — June 23, 2016 — Alliance Memory today extended its offering of 256M high-speed CMOS synchronous DRAMs (SDRAM) with two new x32 devices in the 86-pin 400-mil plastic TSOP II package.

Internally configured as four banks of 8M word x 32 bits, the high-density AS4C8M32S-6TIN and AS4C8M32S-7TCN provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, commercial, medical, telecom, and networking products requiring high memory bandwidth. The SDRAMs offer a synchronous interface, operate from a single +3.3-V (± 0.3 V) power supply, and are lead (Pb)- and halogen-free.

The devices released today feature fast access time from clock down to 5.4 ns and clock rates to 166 MHz, and they are available in commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges. The SDRAMs provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximize performance.

The AS4C8M32S-6TIN and AS4C8M32S-7TCN are the latest in Alliance Memory’s full line of high-speed SDRAMs, which includes components with densities of 16 Mb, 64 Mb, 128 Mb, 256 Mb, and 512 Mb in the 50-pin TSOP II, 54-pin TSOP II, 54-ball TFBGA, 86-pin TSOP II, and 90-ball TFBGA packages. For Alliance Memory customers, the devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company doesn’t perform die shrinks, which frees up engineering resources.

Device Specification Table (new x32 products in bold):

Part number Configuration Clock rate Package Temp. range
AS4C2M32S-6BIN 2M x 32 bit 166 MHz 90-ball TFBGA -40 °C +85 °C
AS4C2M32S-7BCN 2M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C
AS4C2M32SA-6TCN 2M x 32 bit 166 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C2M32SA-6TIN 2M x 32 bit 166 MHz 86-pin TSOP II -40 °C +85 °C
AS4C2M32SA-7TCN 2M x 32 bit 143 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C4M32S-6BIN 4M x 32 bit 166 MHz 90-ball TFBGA -40 °C +85 °C
AS4C4M32S-7BCN 4M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C
AS4C4M32SA-6TCN 4M x 32 bit 166 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C4M32SA-6TIN 4M x 32 bit 166 MHz 86-pin TSOP II -40 °C +85 °C
AS4C4M32SA-7TCN 4M x 32 bit 143 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C8M32S-6BIN 8M x 32 bit 166 MHz 90-ball TFBGA -40 °C +85 °C
AS4C8M32S-6TIN 8M x 32 bit 166 MHz 86-pin TSOP II -40 °C +85 °C
AS4C8M32S-7BCN 8M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C
AS4C8M32S-7TCN 8M x 32 bit 143 MHz 86-pin TSOP II 0 °C to +70 °C

Samples and production quantities of the new SDRAMs are available now, with lead times of six to eight weeks for large orders. Pricing for U.S. delivery starts at $3.95 per piece.

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Press Releases

Alliance Memory Launches New LPSRAMs With Embedded Error-Correction Code; 1Mb and 4Mb Devices Boost Reliability Over Previous Generation Devices

January 25, 2023

Alliance Memory Expands Multiple I/O Serial NOR Flash Memory Series With New 1.8V, 128Mb Solutions; Supporting Single, Dual, and Quad SPI Modes, Devices Offer Fast Read Performance to 133MHz and Operate Over a Single 1.65V to 1.95V Power Supply

January 3, 2023

Alliance Memory Signs Rep Agreement With Eclipse Technologies to Support Customers in Wisconsin and Illinois

November 15, 2022

Alliance Memory to Highlight Latest SRAM, DRAM, eMMC, and Flash Memory ICs at electronica 2022

November 15, 2022

Alliance Memory Rounds Out DDR4 SDRAM Lineup With Six New 4Gb “A” Die Devices and 16Gb Option From Micron Technology; Devices Offer Improved Performance With Lower +1.2V Operating Voltages and Higher Speeds to 1600MHz in 96-Ball and 78-Ball FBGA Packages

September 8, 2022

Visit Alliance Memory at electronica 2022

August 4, 2022

Alliance Memory to Highlight Latest SRAM, DRAM, Flash, and Storage Memory ICs at Embedded World 2022

May 5, 2022

Visit Alliance Memory at Embedded World 2022

April 27, 2022

Alliance Memory 4GB and 8GB eMMC Solutions Simplify Designs and Save Space in Consumer, Industrial, and Networking Applications; Compliant With JEDEC eMMC v5.1, Industrial-Grade Devices Combine NAND Flash Memory With an eMMC Controller in a Single 153-Ball FBGA Package

January 31, 2022

Alliance Memory Signs Rep Agreement With ESI to Support Expanding Customer Base in Southeast and Central U.S.

January 20, 2022

Alliance Memory Cuts Lead Times for DRAMs and Micron NOR Flash Memory Products With Automotive Temperature Ratings

December 2, 2021

Alliance Memory Introduces New Series of 3V Multiple I/O Serial NOR Flash Memory Solutions; AS25F Series Devices Provide Supply Continuity for Micron Technology’s Discontinued N25Q Line

October 21, 2021

More Posts from this Category

PR Contacts

Company Contact

Sue Macedo
sue@alliancememory.com

Agency Contact

Bob Decker
bob.decker@redpinesgroup.com

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US Headquarters

Alliance Memory, Inc
12815 NE 124th St, Suite D
Kirkland, WA 98034
Tel: +1 (425) 898-4456
Fax +1 (425) 896-8628




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