FROM THE PRESIDENT
Alliance is pleased to announce that we had a record month in July. While almost all memory suppliers are reporting tough times right now, Alliance continues to flourish. We are literally seeing hundreds of new design wins a month, as customers are recognizing Alliance and the value that we can bring to them. With our competitive pricing, minimal to no die shrinks, and consistent support, customers seem to be finding us among the giants of the industry. Today we intentionally have our highest inventory level ever, allowing us to support any short-term requirements from customers while our competition reduces their inventory in these more difficult times. We know one thing for sure: In the memory market we can count on change, and when change comes it will come fast. This means tough availability and increased prices.
Alliance continues to add memory products to our portfolio. We have as good a product line-up as anyone in the industry, offering a full breadth of choices in densities, organizations, and packages. We are the one-stop shop for any design engineer. The Micron partnership on the 512M SDRAMs continues to bring new customers to us that are looking for these parts. With our most recent press release announcing our commitment to supporting the 512M SDRAMs through 2017, we feel we will soon have the number one market share in this popular component.
President and CEO
Your Opinion Counts At Alliance Memory
NEW MONOLITHIC HIGH-SPEED, LOW-VOLTAGE CMOS DDR3L SDRAM
Alliance Memory has just introduced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with 8-Gb density in a 96-ball, 9-mm by 14-mm, lead (Pb)-free FBGA. Our new AS4C512M16D3L (512M x 16) features state-of-the art silicon from Micron Technology and offers extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.
With minimal die shrinks, the single-die 8-Gb AS4C512M16D3L is a reliable drop-in, pin-for-pin-compatible replacement for many similar solutions used with newer-generation microprocessors for industrial, medical, networking, telecom, and aerospace applications. If you need increased memory but have board constraints, it’s a great choice that can help you eliminate the need for a costly redesign and/or part requalification.
The AS4C512M16D3L operates from a single +1.35 V power supply and is available with a commercial temperature range of 0 °C to +95 °C (AS4C512M16D3L-12BCN) and an industrial temperature range of -40 °C to +95 °C (AS4C512M16D3L-12BIN). The device is internally configured as eight banks of 512M x 16 bits. Click for more information.
NEW HIGH-SPEED CMOS DOUBLE DATA RATE 2 (DDR2) SYNCHRONOUS DRAMS WITH 2-GB DENSITY IN 84-BALL FBGA PACKAGE
We’re broadening our DDR2 line-up with a new device featuring a high 2-Gb density in the 84-ball 8-mm by 12.5-mm by 1.2-mm FBGA. Hard to find until now, Alliance Memory is offering the new AS4C128M16D2 high-speed CMOS double data rate 2 (DDR2) synchronous DRAM in commercial (0 °C to +85 °C) and industrial (-40 °C to + 95 °C) temperature versions.
A reliable drop-in, pin-for-pin-compatible replacement for a number of similar solutions, the AS4C128M16D2 will be used in automotive, industrial, consumer, networking, and medical products requiring high memory bandwidth. The device is internally configured as eight banks of 16M x 16 bits. The DDR2 SDRAM offers a synchronous interface, operates from a single + 1.8-V (± 0.1 V) power supply, and is RoHS-compliant.Click for more information.