The News: To meet the increasing demand for legacy SLC parallel NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory introduces the new AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb and fast block erase times down to 3ms typical.
Part Numbers: AS9F31G08SA-25BIN, AS9F32G08SA-25BIN, AS9F34G08SA-25BIN, AS9F14G08SA-45BIN, AS9F38G08SA-25BIN, AS9F18G08SA-45BIN, AS9F14G08SA-45BAN, and AS9F18G08SA-45BAN
Key Specifications and Benefits:
- 1.8V and 3.3V VCC
- Densities from 1Gb to 8Gb
- Fast block erase times down to 3 ms typical
- Compliant with the ONFI 1.0 specification
- x8 I/O interface
- Divisible into independently erasable blocks
- Allows valid data to be preserved, while old data is erased
- Reliable, long-term performance
- 100,000 program/erase cycles — with 4-bit ECC per 528 bytes
- 10-year data retention
- Offered in the 9.0 mm by 11.0 mm by 1.0 mm 63-ball FBGA package
- Available in industrial (-40°C to +85°C) and automotive (-40°C to +105°C) temperature ranges
- RoHS-compliant
| Part # | Density | Bus Width | VCC | Package | Temperature |
|---|---|---|---|---|---|
| AS9F31G08SA-25BIN | 1Gb | x8 | 3.3V | 63-ball FBGA | -40°C to +85°C |
| AS9F32G08SA-25BIN | 2Gb | x8 | 3.3V | 63-ball FBGA | -40°C to +85°C |
| AS9F34G08SA-25BIN | 4Gb | x8 | 3.3V | 63-ball FBGA | -40°C to +85°C |
| AS9F14G08SA-45BIN | 4Gb | x8 | 1.8V | 63-ball FBGA | -40°C to +85°C |
| AS9F38G08SA-25BIN | 8Gb (DDP) | x8 | 3.3V | 63-ball FBGA | -40°C to +85°C |
| AS9F18G08SA-45BIN | 8Gb (DDP) | x8 | 1.8V | 63-ball FBGA | -40°C to +85°C |
| AS9F14G08SA-45BAN | 4Gb | x8 | 1.8V | 63-ball FBGA | -40°C to +105°C |
| AS9F18G08SA-45BAN | 8Gb (DDP) | x8 | 1.8V | 63-ball FBGA | -40°C to +105°C |
Target Applications:
- Wi-Fi routers, DSL and cable modems, set-top boxes, digital TVs, artificial intelligence (AI) speakers, Internet of Things (IoT) devices, and more
The Context: While new designs in the automotive, industrial, communications, and consumer electronics markets are migrating toward serial NAND flash for mass storage, many manufacturers’ existing designs still require parallel NAND flash solutions, which are becoming increasingly difficult to find. With Alliance Memory’s AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb, the company is perfectly positioned to provide its customers with a reliable source for these cost-effective solutions moving forward, saving them the expense of redesigns.
Availability: Samples and production quantities of the 1.8V and 3.3V SLC parallel NAND flash memory products are available now, with lead times of 12 weeks.
Link to product datasheets and Buy Now information: AS9F31G08SA-25BIN, AS9F32G08SA-25BIN, AS9F34G08SA-25BIN, AS9F14G08SA-45BIN, AS9F38G08SA-25BIN, AS9F18G08SA-45BIN, AS9F14G08SA-45BAN, and AS9F18G08SA-45BAN
