The News: To meet the growing demand for serial peripheral interface (SPI) NAND Flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory announces the new AS5F series of 1.8V to 3V devices with densities from 1G to 8G and high-speed clock frequencies up to 120MHz.
Key Specifications and Benefits:
- Densities from 1Gb to 8Gb
- High-speed clock frequencies up to 120MHz
- Reliable, long-term performance
- 60,000 program/erase cycles
- 10-year data retention
- Industrial temperature range of -40°C to +85°C
- 25mA read/program currents and 30mA erase currents
- Support standard, dual, and quad SPI operation
- Lead (Pb)- and halogen-free LGA 8-pin package
- Multimedia data storage applications
- Artificial intelligence (AI) implementation
- Wi-Fi routers, mobile devices, xDSL/xPON technologies, data cards, IP cameras, set-top boxes, digital TVs, and smart home devices
The Context: While embedded systems have traditionally relied on SPI NOR Flash for boot code and parallel NAND Flash for data storage, several markets are migrating to SPI NAND Flash memory products, which can fulfill both of these functions. Not only does this reduce BOM costs, but the devices offer superior performance — increased reliability, faster boot-up, and higher write and erase speeds — in a smaller form factor. With the AS5F series, Alliance Memory is perfectly positioned to support its customers as they make the transition to SPI NAND Flash.
Availability: Samples of the 1.8V and 3V SPI NAND Flash memory products will be available in August 2020. Production quantities will be available in September 2020, with lead times of eight weeks.