The News: To meet the growing demand for serial peripheral interface (SPI) NAND Flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory announces the new AS5F series of 1.8V to 3V devices with densities from 1G to 8G and high-speed clock frequencies up to 120MHz.

Parts Table:

Part number	Density	VCC	Speed
AS5F31G04SND-08LIN	1Gb	3V	120MHz
AS5F12G04SND-10LIN	2Gb	1.8V	100MHz
AS5F32G04SND-08LIN	2Gb	3V	120MHz
AS5F14G04SND-10LIN	4Gb	1.8V	100MHz
AS5F34G04SND-08LIN	4Gb	3V	120MHz
AS5F18G04SND-10LIN	8Gb	1.8V	100MHz
AS5F38G04SND-08LIN	8Gb	3V	120Mhz

Key Specifications and Benefits:

• Densities from 1Gb to 8Gb
• High-speed clock frequencies up to 120MHz
• Reliable, long-term performance
• 60,000 program/erase cycles
• 10-year data retention
• Industrial temperature range of -40°C to +85°C
• 25mA read/program currents and 30mA erase currents
• Support standard, dual, and quad SPI operation
• Lead (Pb)- and halogen-free LGA 8-pin package

Target Applications:

• Multimedia data storage applications
• Artificial intelligence (AI) implementation
• Wi-Fi routers, mobile devices, xDSL/xPON technologies, data cards, IP cameras, set-top boxes, digital TVs, and smart home devices

The Context: While embedded systems have traditionally relied on SPI NOR Flash for boot code and parallel NAND Flash for data storage, several markets are migrating to SPI NAND Flash memory products, which can fulfill both of these functions. Not only does this reduce BOM costs, but the devices offer superior performance — increased reliability, faster boot-up, and higher write and erase speeds — in a smaller form factor. With the AS5F series, Alliance Memory is perfectly positioned to support its customers as they make the transition to SPI NAND Flash.

Availability: Samples of the 1.8V and 3V SPI NAND Flash memory products will be available in August 2020. Production quantities will be available in September 2020, with lead times of eight weeks.