The News: Alliance Memory announces that it has expanded the industry’s widest offering of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs with new 512Mb, x8 and x16 devices in the 78-ball and 96-ball FBGA packages, respectively.
Part Numbers: AS4C32M16D3-12BCN, AS4C32M16D3-12BIN, AS4C32M16D3L-12BCN, AS4C32M16D3L-12BIN, AS4C64M8D3-12BCN, AS4C64M8D3-12BIN, AS4C64M8D3L-12BCN, AS4C64M8D3L-12BIN
Availability: Samples of the new 512Mb DDR3 and DDR3L SDRAMs are available now. Production quantities will be available in October 2017, with lead times to eight weeks.
Key Specifications and Benefits:
64Mb x8 and 32Mb x16 configurations
- Available in 78-ball and 96-ball FBGA packages
- Extremely fast transfer rates of 1600Mbps and clock rates of 800MHz
- Single power supply:
- DDR3 SDRAMs: +1.5V (±0.075V)
- DDR3L SDRAMs: +1.35V, with backward compatibility to 1.5V
- JEDEC-compliant
- Available in commercial-extended (0℃ to +95℃) and industrial (-40℃ to +95℃) temperature ranges
- Support sequential and interleave burst types with read or write burst lengths of 4 or 8
- Auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence
- Easy-to-use refresh functions include auto- or self-refresh
- RoHS-compliant, lead (Pb)- and halogen-free
Target Applications:
- Graphics cards
- DIMM modules
- Embedded systems
- Desktop and notebook computers
- Industrial metering applications
- Consumer electronics
- Wireless base stations
