Newsletters
June 2024 Quarterly Newsletter
NEW 5GB AND 10GB 3D pSLC eMMC SOLUTIONS
We’re introducing new industrial-grade 3D pSLC embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications. Offering 30,000 program/erase cycles, the 5GB and 10GB devices integrate high-reliability 3D pSLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm by 1 mm 153-ball FBGA package. Samples will be ready in July 2024. Learn more . . .
MICRON EOL DEVICES: GET YOUR PART NUMBERS BEFORE THEY’RE GONE
For several years, we’ve been supporting our customers by stocking a wide range of EOL 8G DDR3L SDRAMs and NOR Flash devices from Micron Technology. The good news is that we still have a lot of these components in stock on a first come, first served basis — and continue to add part numbers. But once a particular part number is gone, it’s gone. To make sure you don’t come up short further down the road, the time to load up on the devices you’ll need is now.
NEW 16GB AND 32GB LPDDR4X SDRAMS
We’ve expanded our offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package. Learn more . . .
NEW TEAM MEMBER: ZVI BARAK
We’re delighted to announce the appointment of Zvi Barak as our company’s sales director for EMEA. Zvi joins us from Future Electronics, where he served in a number of capacities over the last 18 years, including 10 years as Future’s country manager for Israel. Zvi concluded his time with Future as regional technical director for Eastern Europe. Previously, he held the roles of Israel country manager for Cypress Semiconductor and ASIC designer for Israel Aerospace Industries. You can reach Zvi at zvi@alliancememory.com.
OPERATIONS: ISO 9001:2015 UPDATE
Our headquarters facilities in Kirkland, Washington were recently recertified for ISO 9001:2015. Alliance Memory’s facilities, beginning with our former headquarters in the San Francisco Bay Area, have been ISO 9001-certified since 2009. You can download the Certificate of Registration here.
LETTER FROM THE PRESIDENT
I’ve been holding off for several months on making any statements about the market, since the signals coming from my usual sources of information were too ambiguous to read. About a month ago, however, we started to hear rumblings of price increases from major DRAM suppliers, and now that trend is starting to play out, with big companies going to their customers and saying price increases are on the way. Now people are wondering what the increases are going to be and for which products, and how will lead times be affected.
Most of our customers still have adequate inventory, but some of the larger ones are already asking us for upsides on certain products. There are even pockets of shortages here and there. The DDR3 last time buy announcement from Samsung in April is also having its effect.
All this is by way of a reminder that Alliance Memory has a long track record of being the guy that keeps prices flat and delivers consistent support when others don’t. With everything that’s coming, and especially if you’re a user of DDR3s, right now would be a good time to ask us about sourcing those products for you and locking in the price before ASPs start to rise.
Please feel free at any time to reach out to me directly, and thank you as always for your support.
David Bagby
President and CEO
THE LAST WORD
Embedded World went by in a flash, and our marcom team did a great job in capturing the positive energy at the show in this short video, which also goes by like a flash, and in which you’ll see some familiar (as well as new) faces.
December 2023 Quarterly Newsletter
32GB, 64GB, and 128GB eMMC Solutions
We’ve extended our offering of eMMCs to include densities from 4GB all the way up to 128GB, providing you with a wide range of options to meet your solid-state storage needs in consumer, industrial, and networking applications. The devices integrate TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. Learn more . . .
4Mb and 16Mb 3V Multiple I/O Serial NOR Flash Memory Solutions
With their enhanced performance — including fast read performance up to 104MHz; fast program and erase times down to 1.1ms and 2.6ms, respectively; maximum erase/program currents down to 1.3mA; and maximum read currents down to 3.7mA at 104MHz — our new 4Mb and 16Mb 3V multiple input/output serial NOR flash memory products are designed to meet the demands of the computer, consumer, communications, and IoT markets. Learn more . . .
New “A” Die Version of 8Gb DDR4 SDRAM
Our portfolio of CMOS DDR4 SDRAMs now includes an “A” die version of the 8Gb AS4C512M16D4A-62BAN. The new SDRAM offers a faster clock speed of 1600MHz over an automotive grade temperature range of -40°C to +105°C and is available in densities of 4Gb, 8Gb, and 16Gb in 96-ball and 78-ball FBGA packages. Learn more . . .
“A Memory Technology With a Future”
That’s the title of an article by Sue Macedo and Ramesh Babu of Alliance Memory with Chen Grace Wang of Rutronik in the latest issue of Rutroniker (starting on page 26). Key takeaway: Alliance Memory will continue to offer a wide range of legacy fast and low-power SRAM products with long-term availability, in addition to new innovative technologies.
Save the Date
We will be exhibiting in Nuremberg at Embedded World 2024, April 9 – 11, in booth 3A-215. Learn more about the show here. . .
New Team Member: Kim Newman
Joining Alliance Memory as global account manager for Jabil, Kim Newman brings over 40 years of experience in the electronics industry, including nine years as an independent global manufacturer’s representative. Prior to that, she served in a variety of roles at manufacturer’s representative Sun Marketing Group over a period of 21 years, including channel sales/operations manager and global key account manager. In addition, she has held the positions of product manager at Arrow Electronics and marketing coordinator at Harris Semiconductor/Intersil. We couldn’t be more thrilled to have her on board.
From the President
In a message to the Alliance Memory community last month, President and CEO David Bagby addressed the flash market and how current conditions represent an opportunity for growth. Read the complete text here.
The Last Word
It’s rare that the entire Alliance Memory sales team meets up in a single place. So why not on a beach in Fiji? Here we are in October 2023 celebrating another successful year.
August 2023 Quarterly Newsletter
16GB DDR4 SDRAM
We’ve expanded our portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package. Compared to previous generation DDR3 SDRAMs, the new AS4C1G16D4‑062BCN delivers improved performance with lower power consumption and higher speeds and transfer rates. Learn more . . .
1.8V AND 3.3V SLC PARALLEL NAND FLASH
The new AS9F series of 1.8V and 3.3V devices features densities from 1Gb to 8Gb and fast block erase times down to 3ms typical. Learn more . . .
NEW 2GB, 4GB, 8GB, AND 16GB LPDDR4X SDRAMS
We’ve expanded our offering of high-speed CMOS mobile low-power SDRAMs with four new LPDDR4X devices in a variety of densities. The new devices deliver ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency. Learn more . . .
16GB eMMC
For solid-state storage in consumer, industrial, and networking applications, the ASFC16G31M-51BIN integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. Learn more . . .
NEW MICRON 4GB LPDDR2 SDRAM
We’re now offering Micron Technologies’ 4Gb MT42L128M32D1TJ-25 IT:A LPDDR2 SDRAM, which combines low power consumption of 1.2V with a 400MHz clock rate and 800Mbps/in data rate in the 134-FBGA package. Learn more . . .
NEW TEAM MEMBERS
Two new team members are bolstering our presence in Asia. Kelly Chien has joined Alliance Memory as our country manager for Taiwan, and Linus Park has joined Alliance Memory as our country manager for Korea. In their respective countries, Kelly and Linus will be working closely with our distribution partners to expand sales coverage.
February 2023 Quarterly Newsletter
NEW PRODUCT ANNOUNCEMENTS
New 16Gb DDR4 SDRAM
We’ve expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package. The new AS4C1G16D4-062BCN delivers improved performance over previous-generation DDR3 SDRAMs, with lower power consumption and higher speeds and transfer rates. Read more . . .
New LPSRAMs
New low power asynchronous 1Mb and 4Mb SRAM (LPSRAM) products with feature embedded error-correction code (ECC). Compared to previous-generation devices, the new AS6CE1016A (1Mb) and AS6CE4016B (4Mb) offer better failure in time (FIT) and mean time to failure (MTTF) characteristics with reduced soft error rates (SER). Read more . . .
1.8V, 128Mb Multiple I/O Serial NOR Flash Memory
We’ve expanded our AS25F series of multiple input/output serial NOR flash memory products with two new 1.8V, 128Mb devices. The AS25F1128MQ-70SIN and AS25F1128MQ-70WIN combine fast read performance up to 133MHz with fast page program and sector erase times of 0.3ms and 60ms typical, respectively. Read more . . .
DIMA LUPILIN JOINS THE ALLIANCE MEMORY TEAM
We’re happy to announce that Dima Lupilin has joined Alliance Memory as sales director for California, Mexico, New Zealand, Australia, and Spain. In his new role, Dima is responsible for providing industry-leading support for the company’s extensive customer base in these territories, including identifying the most cost-effective parts from our product line-up for any given application. In addition, he works closely with distribution partners to address any supply issues customers may be experiencing. You can reach him at dima@alliancememory.com.
ECLIPSE TECHNOLOGIES TO SUPPORT ALLIANCE MEMORY CUSTOMERS IN WISCONSIN AND ILLINOIS
Eclipse Technologies Inc., a Milwaukee-based manufacturers’ representative for electronic components, is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Wisconsin and Illinois. Read more . . .
LETTER FROM THE PRESIDENT
The SRAM market in particular is very interesting for us right now. New customers are coming to us with reports of long lead times and not getting deliveries from our competitors. (If this sounds familiar and we haven’t talked yet, please just reply to this E-mail to start the conversation.) We’re actively shipping them the SRAM product they need and looking to support them as long as needed with our good wafer supply backup. I won’t be surprised, in fact, if Q1 2023 turns out to be our best quarter for SRAMs ever.
The DRAM market presents a mixed picture right now. But overall, we’re very positive moving forward in 2023. The flash market remains new and exciting for us, and we’re coming out with new products all the time. Even though we’re still seeing some inventory corrections, we’re beginning the year with a solid customer base, great distribution partners, and a plentiful inventory both in wafers as well as finished goods. We’re seeing every reason to be positive about the rest of 2023. What about you?
Stay safe and thanks as always for your support.
David Bagby
President and CEO
November 2022 Quarterly Newsletter
ELECTRONICA 2022 PREVIEW ISSUE
15 – 18 November 2022
Munich, Germany
Stop by and see us at Hall C3, Stand 328 on the exhibit floor or request an appointment to discuss your projects. Email Sue Macedo at sue@alliancememory.com to schedule a time.
Featured Alliance Memory Products at electronica 2022
eMMCs
Compliant with the JEDEC eMMC v5.1 industry standard, Alliance Memory’s eMMC solutions integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single package for solid-state storage in consumer, industrial, and networking applications. The devices simplify designs for fast and easy system integration — speeding up product development and faster time to market — while saving space by eliminating the need for an external controller. The solutions are compliant with the JEDEC eMMC v5.1 industry standard, and available with densities of 4GB and 8GB. A 16GB device will be released in December 2022.
Link to product listing
Link to product photos
New DDR4 SDRAMs
Built on a finer process that results in a smaller chip than Alliance Memory’s original 4GB DDR4 SDRAMs, new “A” die versions deliver improved performance — with lower power consumption down to +1.2V (±0.06V), faster clock speeds to 1600MHz, and higher transfer rates to 3200Mbps — at a lower cost. The devices are ideal for the industrial, networking, telecommunications, gaming, and consumer markets, for which Alliance Memory is utilizing a dual sourcing strategy to ensure supply longevity. In addition, the company is offering a 16GB Micron Technology DDR SDRAM for a wide range of applications.
Link to product listing
Link to product photos
New 128Mb and 256Mb 1.8V Serial NOR Flash
Alliance Memory’s 3V and 1.8V multiple input/output serial NOR Flash memory products are designed to provide supply continuity to Micron Technology customers utilizing discontinued devices. The NOR Flash products combine fast read performance up to 133MHz with fast program and erase times. Available in 8-pin SOP wide body (208mils) and 8L WSON (6x5mm) packages, the devices provide reliable, long-term performance with high program/erase cycles and long data retention.
Link to product listing
Link to product photos
DDR3 SDRAMs
Alliance Memory’s lineup of DDR3 (1.5V) and DDR3L (1.35V) SDRAMs includes 512Mb, 1Gb, 2Gb, 4Gb, and 8Gb devices in x8/x16 bus widths, offered in 78-ball and 96-ball FBGA packages across commercial, industrial, and automotive temperature ranges. Offering a double data rate architecture for extremely fast transfer rates of up to 2133Mbps/pin and clock rates of 1066MHz, the devices provide reliable drop-in, pin-for-pin compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, medical, networking, consumer, telecom, aerospace, and automotive applications.
Link to product listing
Link to product photos
LETTER FROM THE PRESIDENT
Who would have thought in November 2018 that it would be four years before we’d be back at electronica? We live in unpredictable times, but our increased inventory and competitive pricing continue to carry us through this current cyclical market, and the future is looking bright for Alliance Memory and the industry. We’re excited to see the progress that’s being made in areas like IoT, 5G, and AI, and how our solutions will contribute to the evolution of these technologies.
With the help of our distributor partners and reps, we’ve been helping customers of every shape and size to thrive in an unsettled environment. The things you’ve always appreciated about Alliance Memory, like our policy of maintaining a sizeable parts inventory, aren’t changing. But we’ve come a very long way in the past four years. We’ve added a full lineup of flash products (including the new devices mentioned above) and eMMCs. There’s more in store for 2023. I can’t wait to tell what we’ve planned for the next several months when you stop by our booth at electronica. See you in Munich!
David Bagby
President and CEO