• Skip to primary navigation
  • Skip to content
  • Skip to primary sidebar
  • Skip to footer
Shop Memory, Buy Now Product Listing Download Cross Reference Guide
  • Contact Us
  • About
  • Support
    • Technical Support And Product Resources
    • Product Longevity Statement
    • Terms and Conditions
    • Quality Policy
    • Packaging Quantities
    • Packing Procedures
    • SECURITY
    • End of Life Memory Products
  • Where to Buy-Distributors
    • North American Distributors
    • Latin America & SE Asia Distributors
    • Europe, Middle East, Africa Distributors
    • Pacific Rim Distributors
  • Solutions
    • Cypress CY62256 Replacement
    • Micron 8G DDR3L SDRAM
    • Micron NOR Flash
    • Processor Compatibility Options
      • Analog Devices
      • Atmel/Microchip Technology
      • GOWIN
      • Intel Corporation
      • Lattice Semiconductor
      • Marvell / Cavium
      • NXP Semiconductors
      • Rockchip SoCs
      • STMicroelectronics
      • Texas Instruments
      • Xilinx, Inc.
  • Applications
    • Automotive
    • Mobile and Embedded
    • Medical
  • Products
    • Full Product Catalog
    • DRAMs
      • Micron DRAMs
      • Synchronous DRAMs
      • DDR SDRAM
      • DDR2 SDRAM
      • DDR3 SDRAM
      • DDR4 SDRAM
      • LPDDR Mobile DDR
      • LPDDR2 Mobile DDR 2
      • LPDDR4/X Mobile DDR 4/X
      • LPSDR SDRAM – Mobile SDR
    • SRAMs
      • Fast Asynchronous SRAMs
      • Psuedo SRAMs (PSRAM)
      • Low Power Asynchronous SRAM
      • Synchronous SRAMs
      • ZMD Low Power Asynchronous SRAMs
    • FLASH & Storage
      • Parallel NOR Flash
        • Parallel NOR Flash (5V)
        • Micron M29F NOR Flash (5V)
        • Micron J3/P30/P33 Parallel NOR
      • Serial NOR Flash
        • Micron M45PE Serial NOR Flash
        • Micron N25Q Serial NOR Flash
        • AS25F Serial NOR Flash
      • Serial NAND Flash
      • Parallel NAND Flash
      • eMMC

Alliance Memory

Manufacturer of Legacy Memory SRAM, DRAM, and Flash ICs

Press Releases

September 21, 2023

Alliance Memory Expands eMMC Offering With New 32GB, 64GB, and 128GB Solutions; Simplifying Designs and Saving Space in Consumer, Industrial, and Networking Applications, Industrial-Grade Devices Feature TLC NAND Flash Technology for Increased Reliability

KIRKLAND, Wash. — Sept. 21, 2023 — Alliance Memory today introduced new 32GB, 64GB, and 128GB industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, point-of-sale systems, and emerging embedded applications. For designers, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN simplify designs for fast and easy system integration in these products, speeding up product development and time to market while saving space by eliminating the need for an external controller. In addition, the device’s FTL software provides high reliability and stable performance with wear levelling and bad block management.

“With our latest eMMCs, we’ve extended our offering to include densities from 4GB all the way up to 128GB, providing designers with a wide range of options to meet their mass storage needs and solidifying our position as a leading supplier of eMMC technology,” said David Bagby, president and CEO, Alliance Memory. “Furthermore, with their TLC NAND flash technology, our new 32GB, 64GB, and 128GB solutions deliver even higher reliability, endurance, and performance, while maintaining the same ease of integration as our lower density devices.”

The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN operate over an industrial temperature range of -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.

Samples of the eMMCs are available now. Production quantities are available with lead times of eight to 10 weeks. Pricing for U.S. delivery starts at approximately $9 per piece for the 32GB ASFC32G31T3-51BIN, $12 per piece for the 64GB ASFC64G31T5-51BIN, and $18 per piece for the 128GB ASFC128G32T5-51BIN.

July 27, 2023

Alliance Memory Introduces New Line of 1.8V and 3.3V SLC Parallel NAND Flash Memory Solutions; Compliant With the ONFI 1.0 Specification, 1Gb to 8Gb AS9F Series Devices Deliver Fast Block Erase Times Down to 3 ms

KIRKLAND, Wash. — July 27, 2023 — To meet the increasing demand for legacy SLC parallel NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory today introduced the new AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb and fast block erase times down to 3 ms typical.

“While new designs are migrating toward serial NAND flash for mass storage, many of our customers’ existing designs still require parallel NAND flash solutions, which are becoming increasingly difficult to find,” said David Bagby, president and CEO of Alliance Memory. “With our AS9F series, we’re perfectly positioned to provide our customers with a reliable source for these cost-effective solutions moving forward, saving them the expense of redesigns.”

Compliant with the ONFI 1.0 specification and offering an x8 I/O interface, the memory solutions released today are ideal for use in chipsets for Wi-Fi routers, DSL and cable modems, set-top boxes, digital TVs, artificial intelligence (AI) speakers, Internet of Things (IoT) devices, and more. Divided into blocks that can be erased independently, AS9F series products allow valid data to be preserved in these applications while old data is erased.

Delivering reliable, long-term performance, the parallel NAND flash devices feature 100,000 program/erase cycles — with 4-bit ECC per 528 bytes — and 10-year data retention. Offered in the 9.0 mm by 11.0 mm by 1.0 mm 63-ball FBGA package, the RoHS-compliant solutions are available in industrial (-40°C to +85°C) and automotive (-40°C to +105°C) temperature ranges.

Device Specification Table:

Part #

Density

Bus Width

Vcc

Package

Temperature

AS9F31G08SA-25BIN

1Gb

x8

3.3V

63-ball FBGA

-40°C to +85°C

AS9F32G08SA-25BIN

2Gb

x8

3.3V

63-ball FBGA

-40°C to +85°C

AS9F34G08SA-25BIN

4Gb

x8

3.3V

63-ball FBGA

-40°C to +85°C

AS9F14G08SA-45BIN

4Gb

x8

1.8V

63-ball FBGA

-40°C to +85°C

AS9F38G08SA-25BIN

8Gb (DDP)

x8

3.3V

63-ball FBGA

-40°C to +85°C

AS9F18G08SA-45BIN

8Gb (DDP)

x8

1.8V

63-ball FBGA

-40°C to +85°C

AS9F14G08SA-45BAN

4Gb

x8

1.8V

63-ball FBGA

-40°C to +105°C

AS9F18G08SA-45BAN

8Gb (DDP)

x8

1.8V

63-ball FBGA

-40°C to +105°C

Samples and production quantities of the 1.8V and 3.3V SLC parallel NAND flash memory products are available now, with lead times of 12 weeks.

July 18, 2023

Alliance Memory 2Gb, 4Gb, 8Gb, and 16Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds to 1.86GHz; Solutions Offer ~50% Reduction in Power Consumption Compared to LPDDR4 Devices, Increasing Power Efficiency and Performance

KIRKLAND, Wash. — July 17, 2023 — Alliance Memory today announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with four new LPDDR4X devices in a variety of densities. Offering an extension to the company’s fourth-generation LPDDR4 SDRAMs, the 2Gb AS4C128M16MD4V-062BAN, 4Gb AS4C256M16MD4V-062BAN, 8Gb AS4C512M16MD4V-053BIN, and 16Gb AS4C512M32MD4V-053BIN deliver ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

With low-voltage operation of 0.6V — compared to 1.1V for LPDDR4 SDRAMs — the devices released today increase battery life in portable electronics for the consumer, commercial, and industrial markets, including smartphones, smart speakers, security surveillance systems, and other IoT devices utilizing AI and 5G technologies. Providing increased efficiency for advanced audio and ultra-high-resolution video in embedded applications, the LPDDR4X SDRAMs deliver fast clock speeds up to 1.86GHz for extremely high transfer rates of 3.7Gbps.

For automotive applications — including ADAS systems — the AEC-Q100-qualified AS4C128M16MD4V-062BAN and AS4C256M16MD4V-062BAN offer a temperature range of -40°C to +105°C and on-chip ECC for increased reliability. The AS4C512M16MD4V-053BIN and AS4C512M32MD4V-053BIN operate over an industrial temperature range of -40°C to +85°C.

The AS4C512M16MD4V-053BIN, AS4C128M16MD4V-062BAN, and AS4C256M16MD4V-062BAN are organized as single-channel devices — each consisting of eight banks of 16 bits —while the AS4C512M32MD4V-053BIN offers two channels. All four components provide fully synchronous operation; programmable read and write burst lengths of 16, 32, and on the fly; and selectable output drive strength. An on-chip temperature sensor controls the self-refresh rate.

Alliance Memory’s LPDDR4X SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions in high-bandwidth, high-performance memory system applications, eliminating the need for costly redesigns and part requalification.

Device Specification Table:

Part #

AS4C128M16MD4V-062BAN

AS4C256M16MD4V-062BAN

AS4C512M16MD4V-053BIN

AS4C512M32MD4V-053BIN

Density

2Gb

4Gb

8Gb

16Gb

Organization

128M x 16

256M x 16

512M x 16

512M x 32

VDD1 / VDD2 / VDDQ

1.8V / 1.1V / 0.6V

1.8V / 1.1V / 0.6V

1.8V / 1.1V / 0.6V

1.8V / 1.1V / 0.6V

Package

200-ball TFBGA

200-ball TFBGA

200-ball TFBGA

200-ball TFBGA

Clock frequency

1600MHz

1600MHz

1866MHz

1866MHz

Data rate

3200Mbs

3200Mbs

3733Mbs

3733Mbs

Temp. range

-40°C to +105°C

-40°C to +105°C

-40°C to +85°C

-40°C to +85°C

Samples and production quantities of the new LPDDR4X SDRAMs are available now, with lead times of 12 weeks. Pricing for U.S. delivery ranges from $7.45 to $17.75 in small quantities.

July 13, 2023

Alliance Memory Signs Rep Agreement With Electra Sales to Support Customers in Upstate New York

KIRKLAND, Wash. — July 13, 2023 — Alliance Memory today announced that it has concluded an agreement with Electra Sales, a Rochester, New York-based manufacturers’ sales representative for industry-leading semiconductor, electronic component, and embedded systems integration companies. Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.

Electra Sales has been providing consultative sales services for the Upstate New York market since 1972, with a territory that consists of all counties north of, and including, Orange and Putnam. For the company’s customers, Alliance Memory’s legacy and innovative technology ICs offer reliable drop-in, pin-for-pin compatible replacements for a number of similar solutions across a broad spectrum of applications and markets.

Through its partnership with Alliance Memory, Electra Sales is offering its customers a full range of 3.3V and 5V fast asynchronous devices, synchronous SRAMs, PSRAMs, and low-power SRAMs; 5V parallel NOR and 1.8V and 3V SPI NAND flash ICs; and eMMC solutions. The company’s broad portfolio of high-speed CMOS SDRAMs includes MSDR, DDR, DDR2, DDR3, DDR4, LPDDR, LPDDR2, and LPDDR4 devices in a wide range of densities, configurations, and package options. In addition, Electra Sales’ customers have access to several discontinued devices from Micron Technology, including DDR, DDR3, DDR3L, and SDR SDRAMs, as well as NOR flash ICs.

“In the dynamic and demanding marketplace of Upstate New York, Electra Sales has been a reliable source of customer-centric service for more than four decades,” said Tom Gargan, director of sales for Canada, the Eastern U.S., and Brazil at Alliance Memory. “The company’s collective sales experience, spanning 119 years, showcases a deep knowledge of the diverse segments it serves and a rock-solid understanding of their unique needs. We are thrilled to partner with Electra Sales, who will deliver unmatched service to our customers in the region while providing broader access to our rapidly expanding product portfolio.”

“At Electra Sales, we take pride in partnering with industry-leading manufacturers, and Alliance Memory undoubtedly fits that mold,” said Mark Rogers, president and technical sales engineer at Electra Sales. “Over the last few years, as manufacturer’s have continued to EOL memory devices, the company’s portfolio has expanded significantly. This commitment to meeting market demand and eliminating the cost of redesigns aligns perfectly with our customer-first philosophy, and we couldn’t be more excited to bring these solutions to the Upstate New York market.”

July 6, 2023

Alliance Memory 16GB eMMC Solution Simplifies Designs and Saves Space in Consumer, Industrial, and Networking Applications; Compliant With JEDEC eMMC v5.1, Industrial-Grade Device Combines NAND Flash Memory With an eMMC Controller in a Single 153-Ball FBGA Package

KIRKLAND, Wash. — July 6, 2023 — Alliance Memory today introduced a new 16GB industrial-grade embedded multi-media card (eMMC) solution. For solid-state storage in consumer, industrial, and networking applications, the ASFC16G31M-51BIN integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

The device released today is compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The ASFC16G31M-51BIN is also backwards-compatible with eMMC v4.5 and v5.0.

The eMMC will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, surveillance, automation, point-of-sale systems, and emerging embedded applications. For designers, the ASFC16G31M-51BIN simplifies designs for fast and easy system integration in these products, speeding up product development and time to market while saving space by eliminating the need for an external controller. In addition, the device’s FTL software provides high reliability and stable performance with wear levelling and bad block management.

“eMMCs are a new focus product for Alliance Memory,” said David Bagby, the company’s president and CEO. “We are making a significant investment in this product portfolio, and with further, higher-density additions we’ll be launching in Q3 2023, Alliance Memory is set to become one of the leading providers of eMMC technology.”

The ASFC16G31M-51BIN operates over an industrial temperature range of -40°C to +85°C and offers programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.

Samples of the eMMC are available now. Production quantities are available with lead times of 8 to 10 weeks. Pricing for U.S. delivery starts at approximately $6 per piece.

June 26, 2023

Alliance Memory Further Bolsters Presence in Asia With Appointment of Kelly Chien as Country Manager for Taiwan

KIRKLAND, Wash. — June 26, 2023 — Alliance Memory today announced that it has further strengthened its market presence in Asia with the appointment of Kelly Chien as the company’s country manager for Taiwan. In her new role, she will work closely with Alliance Memory’s distribution partners to expand the company’s sales coverage in the country.

Ms. Chien brings 17 years of experience in the semiconductor industry to Alliance Memory. She comes to the company from Inventec — a Taiwan-based manufacturer of notebook computers, servers, and mobile devices — where she held the position of server sales manager. Previously, as a program manager for Nanya Technology’s marketing division, Ms. Chien was responsible for a $44 million revenue increase over five years and proposed and developed three products. She began her career as an account manager for the Advance Semiconductor Engineering (ASE) Group’s Chong-Li branch. Ms. Chien holds a bachelor’s degree from Chia-Nan University of Pharmacy and Science, and a master’s degree from Taipei Medical University.

“Recently, we’ve doubled-down on our efforts to expand our market presence in Asia, first in Korea, and now in Taiwan with Kelly at the helm,” said David Bagby, president and CEO of Alliance Memory. “With her deep knowledge of the Taiwanese semiconductor market and proven track record of driving revenue growth, whether through sales or marketing, she is the perfect fit to spearhead our efforts in the country. We couldn’t be more thrilled to welcome her to the Alliance team.”

“I’m delighted to be joining Alliance Memory during this phase of momentous growth for the company, both in terms of its product offering and presence in Asia,” said Ms. Chien. “I look forward to contributing to the company’s ongoing success, leveraging my experience in the Taiwanese semiconductor market to expand and support its customer base in the country.”

Ms. Chien is based in Alliance Memory’s Taoyuan office in Taiwan and reports to Mr. Bagby. She can be reached at Kelly@alliancememory.com.

  • Page 1
  • Page 2
  • Page 3
  • …
  • Page 20
  • Next Page »

Primary Sidebar

Publications

  • Press Releases
  • New Product Announcements
  • Newsletters
  • Industry Articles
  • Testimonials
  • Media

PR Contacts

Company Contact

Sue Macedo
sue@alliancememory.com

Agency Contact

Bob Decker
bob.decker@redpinesgroup.com

Footer

US Headquarters

Alliance Memory, Inc
12815 NE 124th St, Suite D
Kirkland, WA 98034
Tel: +1 (425) 898-4456
Fax +1 (425) 896-8628




© 2022 Alliance Memory

Reference:

  • Contact Us
  • Newsletters
  • New Product Announcements
  • Press Releases
  • Testimonials
  • Terms and Conditions
  • Privacy Policy

Sign up for our Newsletter:

Front Page Newsletter Sign Up

  • This field is for validation purposes and should be left unchanged.
Visit Us On LinkedinVisit Us On YoutubeVisit Us On TwitterVisit Us On Facebook