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Alliance Memory

Manufacturer of Legacy Memory SRAM, DRAM, and Flash ICs

Press Releases

May 5, 2022

Alliance Memory to Highlight Latest SRAM, DRAM, Flash, and Storage Memory ICs at Embedded World 2022

KIRKLAND, Wash. — May 5, 2022 — Alliance Memory today announced its technology lineup for Embedded World 2022, taking place June 21-23 in Nuremberg, Germany. Exhibiting in Hall 1, Stand 639, the company will highlight its latest SRAM, DRAM, flash, and storage memory ICs for embedded platforms.

“It’s been more than two years since Alliance Memory has exhibited at an in-person trade show,” said David Bagby, president and CEO of Alliance Memory. “During that time, we’ve been proudly supporting the European market with a reliable source of legacy memory chips that were otherwise in short supply, especially our Micron Technology flash devices, which we’ve been able to keep in stock due to our special relationship with the company. But the long wait is finally over, and we’re excited to meet up with our valued distributors and customers again at Embedded World 2022. We can’t wait to see everyone in Nuremberg.”

On display at Embedded World 2022, Alliance Memory’s latest offering for the embedded market includes 4GB and 8GB industrial grade embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications. The devices each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5mm by 13mm 153-ball FBGA package. Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes.

Alliance Memory will also be highlighting high-speed CMOS mobile low-power SDRAMs featuring on-chip ECC. With low-voltage operation of 1.1 V and 0.6 V, respectively, the LPDDR4 and LPDDR4x devices increase battery life in portable electronics for the consumer, commercial, and industrial markets, including tablets, wearables, smartphones, smart speakers, and other IoT devices utilizing AI and 5G technologies. Providing increased efficiency for advanced audio and high-resolution video in embedded applications, the low-power SDRAMs deliver fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications — including infotainment and ADAS systems — the AEC-Q100 qualified devices operate over a temperature range of -40°C to +105°C.

To meet the growing demand for serial peripheral interface (SPI) NAND flash memory products in the automotive, industrial, communications, and consumer electronic markets, Alliance Memory will be exhibiting its AS5F series of 1.8V to 3V devices with densities from 1Gb to 8Gb and high-speed clock frequencies up to 120MHz. Offering reliable, long-term performance, the SPI NAND flash products feature more than 60,000 program/erase cycles, offer 10-year data retention, and support standard, dual, and quad SPI operation. With their enhanced performance, the devices meet the requirements for multimedia data storage applications and AI implementation.

In addition, Alliance Memory will showcase its AS25F line of 3V multiple input/output serial NOR flash memory products, which are designed to provide supply continuity for Micron Technology customers utilizing discontinued N25Q series devices. The AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively. Available in 8-pin SOP Wide Body (209mils) and 8L WSON (6x5mm) packages, the devices provide reliable, long-term performance with 100,000 program/erase cycles and 10-year data retention.

For free admission to Embedded World 2022, register at https://www.messe-ticket.de/Nuernberg/embeddedworld/Register using personalized voucher code ew22466864.

April 27, 2022

Visit Alliance Memory at Embedded World 2022

21 – 23 June 2022
Nuremberg, Germany

Stop by and see us at Hall 1, Stand 639 on the exhibit floor or request an appointment to discuss your projects. Email Sue Macedo at sue@alliancememory.com to schedule a time.

For free admission, register at https://www.messe-ticket.de/Nuernberg/embeddedworld/Register using personalized voucher code ew22466864.

New Alliance Memory Products on Display at Embedded World 2022

Industrial-Grade 4GB and 8GB eMMCsAlliance eMMC

For solid-state storage in consumer, industrial, and networking applications, Alliance Memory’s 4GB and 8GB embedded multi-media card(eMMC) solutions each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support a wide range of features, from boot operation to high-speed HS200 and HS400 modes.

Link to product listing
Link to product photos

High-Speed CMOS Mobile Low-Power SDRAMs With On-Chip ECC
Alliance LPDDR4/X

With low-voltage operation of 1.1V and 0.6V, respectively, Alliance Memory’s LPDDR4 and LPDDR4x devices increase battery life in portable electronics and IoT devices utilizing AI and 5G technologies. Providing increased efficiency for advanced audio and high-resolution video in embedded applications, the low-power SDRAMs deliver fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications, the AEC-Q100 qualified devices operate over a temperature range of -40°C to +105°C.

Link to product listing
Link to product photos (LPDDR4)
Link to product photos (LPDDR4x)

1.8V to 3V SPI NAND Flash1.8V to 3V SPI NAND Flash

Alliance Memory’s AS5F series of 1.8V to 3V SPI NAND flash products offers densities from 1Gb to 8Gb and high-speed clock frequencies up to 120MHz for automotive, industrial, communications, and consumer electronic markets. Providing reliable, long-term performance, the devices feature more than 60,000 program/erase cycles, offer 10-year data retention, and support standard, dual, and quad SPI operation. With their enhanced performance, the flash products meet the requirements for multimedia data storage applications and AI implementation.

Link to product listing
Link to product photos

3V Multiple I/O Serial NOR Flash3V Multiple I/O Serial NOR Flash

Alliance Memory’s AS25F line of 3V multiple input/output serial NOR flash memory products are designed to provide supply continuity for Micron Technology customers utilizing discontinued N25Q series devices. The AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively. Available in 8-pin SOP Wide Body (209mils) and 8L WSON (6x5mm) packages, the devices provide reliable, long-term performance with 100,000 program/erase cycles and 10-year data retention.

Link to product listing
Link to product photos

January 31, 2022

Alliance Memory 4GB and 8GB eMMC Solutions Simplify Designs and Save Space in Consumer, Industrial, and Networking Applications; Compliant With JEDEC eMMC v5.1, Industrial-Grade Devices Combine NAND Flash Memory With an eMMC Controller in a Single 153-Ball FBGA Package

KIRKLAND, Wash. — Jan. 27, 2022 — Alliance Memory today introduced two new industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the 4GB ASFC4G31M-51BIN and 8GB ASFC8G31M-51BIN each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation; replay protected memory block (RPMB); device health report; field firmware updates; power off notification; enhanced strobe features for faster and more reliable operation; write leveling; high-priority interrupt (HPI); secure trim/erase; and high-speed HS200 and HS400 modes. The ASFC4G31M-51BIN and ASFC8G31M-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, infotainment, CCTV, surveillance, automation, point-of-sale systems and emerging embedded applications. For designers, the ASFC4G31M-51BIN and ASFC8G31M-51BIN simplify designs for fast and easy system integration in these products — speeding up product development and time to market — while saving space by eliminating the need for an external controller. In addition, the devices’ FTL software provides high reliability and stable performance with wear levelling and bad block management.

The ASFC4G31M-51BIN and ASFC8G31M-51BIN operate over an industrial temperature range of -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The devices’ NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.

Samples and production quantities of the eMMCs will be available in Q1 2022, with lead times of 12 weeks.

January 20, 2022

Alliance Memory Signs Rep Agreement With ESI to Support Expanding Customer Base in Southeast and Central U.S.

KIRKLAND, Wash. — Jan. 20, 2022 — Alliance Memory today announced that it has concluded an agreement with Electronic Salesmasters Inc. (ESI), a Beachwood, Ohio-based manufacturers’ representative for electronic components. Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, and flash ICs to its customers throughout the southeast and central United States, including Michigan, Indiana, Western Pennsylvania, Ohio, Kentucky, Tennessee, Alabama, Georgia, North Carolina, and South Carolina, with its HHP Associates division serving Florida.

ESI has been providing sales and engineering services to the electronics industry since 1972. For the company’s customers, Alliance Memory’s legacy ICs offer reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions across a broad spectrum of applications, including industrial, appliances, communications, transportation, military, instrumentation, datacom, medical, automotive, and more.

Through its partnership with Alliance Memory, ESI is offering its customers a full range of 3.3V and 5V fast asynchronous devices, synchronous SRAMs, PSRAMs, and low-power SRAMs; 5V parallel NOR and 1.8V and 3V SPI NAND flash ICs; and embedded multimedia card (eMMC) solutions. The company’s broad portfolio of high-speed CMOS SDRAMs includes MSDR, DDR, DDR2, DDR3, DDR4, LPDDR, LPDDR2, and LPDDR4 devices in a wide range of densities, configurations, and package options. In addition, ESI customers have access to several discontinued devices from Micron Technology, including DDR, DDR3, DDR3L, and SDR SDRAMs, as well as NOR flash ICs.

“ESI has been serving a wide range of markets in the electronics industry for five decades, during which time the company has earned an international reputation for its extensive engineering knowledge and synergistic product lines,” said Tom Gargan, director of sales for Canada, the Eastern U.S., and Brazil at Alliance Memory. “For states in the southeast and central U.S. where we currently only offer remote coverage, this partnership will provide our customers with greater access to our legacy ICs while offering them a team of knowledgeable sales engineers for outstanding service.”

“Over the last few years, Alliance Memory’s portfolio of memory solutions has grown rapidly. Furthermore, in a time when IC shortages are the norm, the company has managed to keep its lead times short,” said Spencer Abramson, president of ESI. “Not surprisingly, these two factors have led to tremendous growth for the company. We couldn’t be more excited to add Alliance Memory’s long-term memory solutions to our line card and support the company’s expanding customer base.”

December 2, 2021

Alliance Memory Cuts Lead Times for DRAMs and Micron NOR Flash Memory Products With Automotive Temperature Ratings

KIRKLAND, Wash. — Dec. 2, 2021 — Alliance Memory today announced that it has greatly reduced lead times for its DRAMs and Micron Technology NOR Flash memory devices with automotive temperature ratings. Responding to customer demand, the company now holds 70 parts in finished goods stock and can provide lead times of just six weeks for its most popular automotive temperature range products.

Alliance Memory offers a complete lineup of CMOS SDRAMs — including DDR1, DDR2, DDR3/L, LPDDR4, and LPDDR4X devices — with automotive temperature ratings of -40°C to +105°C. The company’s portfolio of automotive SDRAM products includes:

  • SDR SDRAMs with densities of 64Mb, 128Mb, and 256Mb
  • DDR1 SDRAMs with densities of 64Mb, 256Mb, and 512Mb
  • DDR2 SDRAMs with densities of 512Mb,1Gb, and 2Gb
  • DDR3/L SDRAMs with densities of 1Gb, 2Gb, 4Gb, and 8Gb
  • LPDDR4 and LPDDR4X SDRAMs with densities of 2Gb, 4Gb, and 8Gb

The company’s offering of automotive temperature Micron NOR Flash memory includes 2Mb, 4Mb, 8Mb, and 16Mb 5V Parallel NOR devices from the M29F series, and 32Mb and 64Mb Serial NOR components from the N25Q series. The parts are offered with temperature ratings of -40°C to +85°C and -40°C to +125°C in a variety of package options.

Alliance Memory’s automotive temperature DRAMs and Micron Flash parts are AEC-Q100-compliant products for high-temperature-requirement applications, including Advanced Driving Assistance Systems (ADAS); powertrain; automotive active safety and autonomous driving; connectivity and in-vehicle-networking (IVN); carputers (customized PCs in cars); telematics; and infotainment systems.

A complete list of automotive memory solutions from Alliance Memory is available here: https://www.alliancememory.com/datasheets/automotive-memory-solutions/.

October 21, 2021

Alliance Memory Introduces New Series of 3V Multiple I/O Serial NOR Flash Memory Solutions; AS25F Series Devices Provide Supply Continuity for Micron Technology’s Discontinued N25Q Line

KIRKLAND, Wash. — Oct. 21, 2021 — Alliance Memory today announced a new line of 3V multiple input/output serial NOR flash memory products designed to provide supply continuity for Micron Technology customers utilizing discontinued N25Q series devices. Offering support for single, dual, and quad SPI modes, the AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively.

Available in 8-pin SOP Wide Body (209mils) and 8L WSON (6x5mm) packages, the devices released today operate from a single 2.7V to 3.6V power supply over an industrial temperature range of -40°C to +85°C. The solutions offer typical erase/program currents of 20mA and maximum read currents of 25mA at 104MHz, and they provide reliable, long-term performance with 100,000 program/erase cycles and 10-year data retention.

AS25F series devices support uniform 4KB or 32KB or 64KB erase, offer an 8/16/32/64byte wrap-around burst read mode, and feature program/erase suspend and resume. Advanced security features include block protection and 4K-bit secured OTP to protect content from hostile access and inadvertent programming and erasing.

With their enhanced performance, the serial NOR flash memory products are designed to meet the demands of the computer, consumer, communications, IoT, and mobile markets. The devices are ideal for use in chipsets for PCs, DVD and Blu-ray players, wireless LANs and cable modems, printers, set-top boxes, LCD displays, mobile and wearable devices, digital cameras, handheld GPS units, smart meters, and more.

Device Specification Table:

Part number AS25F364MQ-10SIN AS25F364MQ-10WIN
Density 64Mb
Bus width Serial Multi IO (x1/x2/x4)
VCC 2.7V to 3.6V
Frequency 104MHz
Active read current max. 25mA
Program / erase current max. 25mA
Standby current max. 10µA
Temperature range -40°C to +85°C
Package 8-pin SOP Wide Body (209 mils) 8L WSON (6mm x 5mm)

Samples and production quantities of the 3V serial NOR flash memory products are available now, with lead times of 16 to 20 weeks.

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PR Contacts

Company Contact

Sue Macedo
sue@alliancememory.com

Agency Contact

Bob Decker
bob.decker@redpinesgroup.com

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US Headquarters

Alliance Memory, Inc
12815 NE 124th St, Suite D
Kirkland, WA 98034
Tel: +1 (425) 898-4456
Fax +1 (425) 896-8628




© 2022 Alliance Memory

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