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Alliance Memory

Manufacturer of Legacy Memory SRAM, DRAM, and Flash ICs

March 24, 2014

Alliance Memory Launches New x32 High-Speed CMOS SDRAMs in 90-Ball TFBGA and 86-Pin TSOP II Packages

SAN CARLOS, Calif. — Mar. 24, 2014 — Alliance Memory today extended its offering of 64M, 128M, and 256M high-speed CMOS synchronous DRAMs (SDRAM) with new x32 devices in the 90-ball 8-mm by 13-mm by 1.2-mm TFBGA, and 86-pin 400-mil plastic TSOP II packages.

The 2M x 32 AS4C2M32S-6TIN and AS4C2M32S-6BIN; 4M x 32 AS4C4M32S-6TIN and AS4C4M32S-6BIN; and 8M x 32 AS4C8M32S-7BCN provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, commercial, medical, telecom, and networking products requiring high memory bandwidth. For these applications, the devices feature fast access time from clock down to 5.4 ns.

The devices provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximize performance.

The AS4C2M32S-6TIN, AS4C2M32S-6BIN, AS4C4M32S-6TIN, AS4C4M32S-6BIN, and AS4C8M32S-7BCN are the latest in Alliance Memory’s full line of high-speed SDRAMs, which includes devices with densities of 16 Mb, 64 Mb, 128 Mb, 256 Mb, and 512 Mb in the 50-pin TSOP II, 54-pin TSOP II, 54-ball TFBGA, 86-pin TSOP II, and 90-ball TFBGA packages. The AS4C2M32S-6BIN and AS4C4M32S-6BIN are also available in commercial temperature versions, the AS4C2M32S-7BCN and AS4C4M32S-7BCN.

Device Specification Table (new products highlighted in orange):

Part Number Density Configuration Package Temp. Range
AS4C2M32S-5TCN 2M x 32 bit 200 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C2M32S-6TCN 2M x 32 bit 166 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C2M32S-6TIN 2M x 32 bit 166 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C2M32S-6BIN 2M x 32 bit 166 MHz 90-ball TFBGA -40 °C to +85 °C
AS4C2M32S-7TCN 2M x 32 bit 143 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C2M32S-7BCN 2M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C
AS4C4M32S-6TCN 4M x 32 bit 166 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C4M32S-6TIN 4M x 32 bit 166 MHz 86-pin TSOP II -40 °C to +85 °C
AS4C4M32S-6BIN 4M x 32 bit 166 MHz 90-ball TFBGA -40 °C to +85 °C
AS4C4M32S-7TCN 4M x 32 bit 143 MHz 86-pin TSOP II 0 °C to +70 °C
AS4C4M32S-7BCN 4M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C
AS4C8M32S-6BIN 8M x 32 bit 166 MHz 90-ball TFBGA -40 °C to +85 °C
AS4C8M32S-7BCN 8M x 32 bit 143 MHz 90-ball TFBGA 0 °C to +70 °C

Samples and production quantities of the new SDRAMs are available now, with lead times of six to eight weeks for large orders. Pricing for U.S. delivery starts at $1.50 per piece.

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Press Releases

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device; 1Gb x 16-bit DDR4 SDRAM Combines Low 1.2V Power Consumption With Fast Clock Speeds to 1600MHz and Transfer Rates to 3200 MT/s in 96-Ball FBGA Package

February 14, 2023

Alliance Memory Launches New LPSRAMs With Embedded Error-Correction Code; 1Mb and 4Mb Devices Boost Reliability Over Previous Generation Devices

January 25, 2023

Alliance Memory Expands Multiple I/O Serial NOR Flash Memory Series With New 1.8V, 128Mb Solutions; Supporting Single, Dual, and Quad SPI Modes, Devices Offer Fast Read Performance to 133MHz and Operate Over a Single 1.65V to 1.95V Power Supply

January 3, 2023

Alliance Memory Signs Rep Agreement With Eclipse Technologies to Support Customers in Wisconsin and Illinois

November 15, 2022

Alliance Memory to Highlight Latest SRAM, DRAM, eMMC, and Flash Memory ICs at electronica 2022

November 15, 2022

Alliance Memory Rounds Out DDR4 SDRAM Lineup With Six New 4Gb “A” Die Devices and 16Gb Option From Micron Technology; Devices Offer Improved Performance With Lower +1.2V Operating Voltages and Higher Speeds to 1600MHz in 96-Ball and 78-Ball FBGA Packages

September 8, 2022

Visit Alliance Memory at electronica 2022

August 4, 2022

Alliance Memory to Highlight Latest SRAM, DRAM, Flash, and Storage Memory ICs at Embedded World 2022

May 5, 2022

Visit Alliance Memory at Embedded World 2022

April 27, 2022

Alliance Memory 4GB and 8GB eMMC Solutions Simplify Designs and Save Space in Consumer, Industrial, and Networking Applications; Compliant With JEDEC eMMC v5.1, Industrial-Grade Devices Combine NAND Flash Memory With an eMMC Controller in a Single 153-Ball FBGA Package

January 31, 2022

Alliance Memory Signs Rep Agreement With ESI to Support Expanding Customer Base in Southeast and Central U.S.

January 20, 2022

Alliance Memory Cuts Lead Times for DRAMs and Micron NOR Flash Memory Products With Automotive Temperature Ratings

December 2, 2021

More Posts from this Category

PR Contacts

Company Contact

Sue Macedo
sue@alliancememory.com

Agency Contact

Bob Decker
bob.decker@redpinesgroup.com

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US Headquarters

Alliance Memory, Inc
12815 NE 124th St, Suite D
Kirkland, WA 98034
Tel: +1 (425) 898-4456
Fax +1 (425) 896-8628




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