New Product Announcement: New 256M High-Speed CMOS SDRAMs

AS4C8M32S-6TIN and AS4C8M32S-7TCN: New 256M High-Speed CMOS SDRAMs

The News: Alliance Memory extends its offering of 256M high-speed CMOS synchronous DRAMs (SDRAM) with two new x32 devices in the 86-pin 400-mil plastic TSOP II package.

Key Specifications and Benefits:

• Feature the 86-pin 400-mil plastic TSOP II package
• Internally configured as four banks of 8M word x 32 bits
• Offer a synchronous interface
• Operate from a single +3.3-V (± 0.3 V) power supply
• Fast access time from clock down to 5.4 ns and clock rates to 166 MHz
• Available in commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges
• Programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option
• Auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence
• Easy-to-use refresh functions include auto- or self-refresh
• Programmable mode register allows the system to choose the most suitable modes to maximize performance
• Lead (Pb)- and halogen-free

Target Applications:

• Industrial, commercial, medical, telecom, and networking products

The Context: The high-density AS4C8M32S-6TIN and AS4C8M32S-7TCN provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, commercial, medical, telecom, and networking products requiring high memory bandwidth. The devices are the latest in Alliance Memory’s full line of high-speed SDRAMs, which includes components with densities of 16 Mb, 64 Mb, 128 Mb, 256 Mb, and 512 Mb in the 50-pin TSOP II, 54-pin TSOP II, 54-ball TFBGA, 86-pin TSOP II, and 90-ball TFBGA packages. For Alliance Memory customers, the devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company doesn’t perform die shrinks, which frees up engineering resources.

Availability: Samples and production quantities of the new SDRAMs are available now, with lead times of six to eight weeks for large orders.

Alliance Memory’s Complete Portfolio of x32 SDRAMs

Part number	Configuration	Clock rate	Package	Temp. range
AS4C2M32S-6BIN	2M x 32 bit	166 MHz	90-ball TFBGA	-40 °C +85 °C
AS4C2M32S-7BCN	2M x 32 bit	143 MHz	90-ball TFBGA	0 °C to +70 °C
AS4C2M32SA-6TCN	2M x 32 bit	166 MHz	86-pin TSOP II	0 °C to +70 °C
AS4C2M32SA-6TIN	2M x 32 bit	166 MHz	86-pin TSOP II	-40 °C +85 °C
AS4C2M32SA-7TCN	2M x 32 bit	143 MHz	86-pin TSOP II	0 °C to +70 °C
AS4C4M32S-6BIN	4M x 32 bit	166 MHz	90-ball TFBGA	-40 °C +85 °C
AS4C4M32S-7BCN	4M x 32 bit	143 MHz	90-ball TFBGA	0 °C to +70 °C
AS4C4M32SA-6TCN	4M x 32 bit	166 MHz	86-pin TSOP II	0 °C to +70 °C
AS4C4M32SA-6TIN	4M x 32 bit	166 MHz	86-pin TSOP II	-40 °C +85 °C
AS4C4M32SA-7TCN	4M x 32 bit	143 MHz	86-pin TSOP II	0 °C to +70 °C
AS4C8M32S-6BIN	8M x 32 bit	166 MHz	90-ball TFBGA	-40 °C +85 °C
AS4C8M32S-6TIN	8M x 32 bit	166 MHz	86-pin TSOP II	-40 °C +85 °C
AS4C8M32S-7BCN	8M x 32 bit	143 MHz	90-ball TFBGA	0 °C to +70 °C
AS4C8M32S-7TCN	8M x 32 bit	143 MHz	86-pin TSOP II	0 °C to +70 °C

Click to download the AS4C8M32S-6TIN and AS4C8M32S-7TCN datasheet.

Contact David Bagby, david@alliancememory.com, +1 650 610-6800