SAN CARLOS, Calif. — Feb. 21, 2019 —Alliance Memory today announced its technology lineup for Embedded World 2019, taking place Feb. 26-28 at the Exhibition Centre in Nuremberg, Germany. Exhibiting at the trade fair for the first time (Hall 3A, Stand 613), the company will highlight its extensive line of automotive temperature SDRAMs, high-speed pseudo SRAMs (PSRAMs), and the latest additions to its portfolio of mobile low-power SDRAMs, including SDR (LPSDR), double data rate (LPDDR), and DDR2 (LPDDR2) devices. Alliance Memory will also showcase its offering of discontinued Cypress Semiconductor CY62256 low-power SRAMs and end-of-life MT41K512M16 8G DDR3L SDRAMs from Micron Technology.

At Embedded World 2019, Alliance Memory will showcase its complete lineup of automotive temperature CMOS SDRAMs, including double data rate (DDR), DDR2, and DDR3 devices in a wide range of densities. The AEC-Q100-compliant DRAMs are optimized for high temperature requirement applications, including Advanced Driving Assistance Systems (ADAS); powertrain; automotive active safety and autonomous driving; connectivity and in-vehicle-networking (IVN); carputers (customized PCs in cars); telematics; and infotainment systems.

For wireless, automotive, networking, and industrial applications, highlighted PSRAMs feature densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages. The devices offer industrial temperature ranges and fast access speeds of 70s. They operate from a single power supply of 1.7V to 1.95V or 2.6V to 3.3V. Power-saving features for the PSRAMs include auto temperature-compensated self-refresh (ATCSR), partial array self-refresh (PASR), and a deep power down (DPD) mode.

To extend battery life in mobile devices, the LPSDR SDRAMs that Alliance Memory will feature at Embedded World 2019 offer power consumption of 1.8V and densities of 128Mb, 256Mb, and 512Mb in 54-ball and 90-ball FBGA packages. Highlighted LPDDR devices feature power consumption from 1.7V to 1.95V and densities of 256Mb, 512Mb, 1Gb, and 2Gb in the 60-ball and 90-ball FBGA packages. Enabling ultra-slim designs, LPDDR2 SDRAMs on display offer power consumption of 1.2V/1.8V and densities of 1Gb, 2Gb, and 4Gb in the 134-ball FBGA package.

Alliance Memory is collaborating with Cypress Semiconductor Corporation to help ensure ongoing availability of some of the CY62256 series 32k x 8 SRAMs, offering them with their original part numbers. Alliance Memory will showcase this offering at Embedded World 2019, in addition to its own direct replacement for the devices: the AS6C62256 family.

Alliance Memory is also offering several end-of-life 8G DDR3L SDRAMs for which Micron Technology announced a last-time buy date of Jan. 13, 2019. The MT41K512M16 devices will be on display, along with versions for three of the ICs featuring Alliance Memory part numbers and the same genuine single-die Micron silicon as the Micron-numbered parts.

Alliance Memory’s ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, automotive, medical, communications, telecom, and consumer electronics products. The devices eliminate costly redesigns by providing long-term EOL components. In addition, the company performs minimal or no die shrinks, which frees up engineering resources.