DISCONTINUED MICRON TECHNOLOGY LEAD (PB)-BEARING DDR, DDR2, AND SDR SDRAMS
Alliance Memory is now selling Micron Technology lead (Pb)-bearing double data rate (DDR), double data rate 2 (DDR2), and single data rate (SDR) devices that Micron discontinued with Micron PCN #31396 (last time buy: April 15, 2015; last time ship: Nov. 30, 2015). This builds on our success in providing continued support for Micron’s legacy 512M SDRAMs and will allow even more customers to avoid investing in redesigns.See the complete list . . .
NEW MONOLITHIC HIGH-SPEED, LOW-VOLTAGE 1G X 8 CMOS DDR3L SDRAM IN 78-BALL FBGA
Alliance Memory has just announced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 78-ball, 9-mm by 13.2-mm, lead (Pb)-free FBGA package. Delivering increased power efficiency for high-end computer and storage systems, our new 1G x 8 AS4C1G8MD3L offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz. Read more . . .
NEW 256M HIGH-SPEED CMOS SDRAMS IN THE 86-PIN TSOP
We’ve extended our offering of 256M high-speed CMOS synchronous DRAMs (SDRAM) with two new x32 devices in the 86-pin 400-mil plastic TSOP II package. Internally configured as four banks of 8M word x 32 bits, the high-density AS4C8M32S-6TIN and AS4C8M32S-7TCN provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, commercial, medical, telecom, and networking products requiring high memory bandwidth. The SDRAMs offer a synchronous interface, operate from a single +3.3-V (± 0.3 V) power supply, and are lead (Pb)- and halogen-free. Read more . . .
FROM THE PRESIDENT
As a supplier of legacy memory ICs, we’re acutely aware of the need for all our customers to simplify their supply chains as much as possible. That’s one reason why we’re expanding our product lines at Alliance Memory to include several new ranges of products. Alliance Memory’s SRAM and DRAM line-up is now comparable to any other supplier in the market. In the coming months look for additions to our mobile, low-power DRAM offerings and new products with high-temperature ratings for automotive systems. Our automotive-grade parts will all be AEC-Q100 compliant and, as with all our products, will be fabricated in facilities that carry the ISO/TS 16949:2009 certification specific to the automotive industry. We look forward to being able to address an ever greater portion of your memory IC needs.
David Bagby
President and CEO
