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Alliance Memory

Manufacturer of Legacy Memory SRAM, DRAM, and Flash ICs

New Product Announcements

New 4GB and 8GB eMMC Solutions

The News: Alliance Memory introduces two new industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the 4GB ASFC4G31M-51BIN and 8GB ASFC8G31M-51BIN each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

Part Numbers: ASFC4G31M-51BIN and ASFC8G31M-51BIN

Key Specifications and Benefits:

  • Compliant with the JEDEC eMMC v5.1 industry standard to support features such as:
    • Boot operation
    • Replay protected memory block (RPMB)
    • Device health report
    • Field firmware updates
    • Power off notification
    • Enhanced strobe features for faster and more reliable operation
    • Write leveling
    • High-priority interrupt (HPI)
    • Secure trim/erase
    • High-speed HS200 and HS400 modes
  • Backwards-compatible with eMMC v4.5 and v5.0
  • Operate over an industrial temperature range of -40°C to +85°C
  • Offer programmable bus widths of x1, x4, and x8
  • NAND memory with internal LDO can be powered with a single 3V supply voltage
  • The controller can be powered by 1.8V or 3V dual supply voltages

Target Applications:

  • Smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, infotainment, CCTV, surveillance, automation, point-of-sale systems and emerging embedded applications

The Context: For solid-state storage in consumer, industrial, and networking applications, Alliance Memory’s new 4GB ASFC4G31M-51BIN and 8GB ASFC8G31M-51BIN eMMC solutions integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. For designers, the devices simplify designs for fast and easy system integration — speeding up product development and faster time to market — while saving space by eliminating the need for an external controller. In addition, the devices’ FTL software provides high reliability and stable performance with wear levelling and bad block management.

Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support a wide range of features such as boot operation; replay protected memory block (RPMB); device health report; field firmware updates; power off notification; enhanced strobe features for faster and more reliable operation; write leveling; high-priority interrupt (HPI); secure trim/erase; and high-speed HS200 and HS400 modes. The ASFC4G31M-51BIN and ASFC8G31M-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

Availability: Samples and production quantities of the eMMCs will be available in Q1 2022, with lead times of 12 weeks.

Link to Product Datasheets and Buy Now information: https://www.alliancememory.com/emmc/

Link to Product Introduction Video: https://youtu.be/a4LgvKF9gbw

3V, 64Mb Multiple I/O Serial NOR N25Q Replacement Flash Memory Solutions

The News: Alliance Memory announces a new line of 3V multiple input/output serial NOR flash memory products designed to provide supply continuity for customers utilizing discontinued Micron Technology N25Q series devices as well as equivalents from other suppliers such as the W25Q, AT25Q, S25F, MX25L, IS25L and GD25Q series. Offering support for single, dual, and quad SPI modes, the AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively.

Part numbers: AS25F364MQ-10SIN, AS25F364MQ-10WIN

Key Benefits:

  • Operates in single, dual, and quad I/O SPI modes
  • High performance and high bandwidth read, erase, and program
  • Uniform 4KB, 32KB, and 64KB erase
  • Advanced security features (block protection, OTP)
  • Program/erase, suspend and resume
  • Burst read

Device Specification Table:

Part number AS25F364MQ-10SIN AS25F364MQ-10WIN
Density 64Mb
Bus width Serial Multi IO (x1/x2/x4)
VCC 2.7V to 3.6V
Frequency 104MHz
Active read current max. 25mA
Program / erase current max. 25mA
Standby current max. 10µA
Temperature range -40°C to +85°C
Package 8-pin SOP Wide Body (209 mils) 8L WSON (6mm x 5mm)

Target Applications:

  • Computing, including notebook PCs, data storage
  • Consumer electronics, including DVD and BluRay players, printers, set-top boxes, mobile phones, digital cameras, wearables
  • Communications systems, including WLANs, DSL / cable modems, GPS
  • Industrial systems, including IoT, smart meters

Availability: Samples and production quantities of the 3V serial NOR flash memory products are available now, with lead times of 16 to 20 weeks.

Link to product datasheets and Buy Now information: AS25F364MQ-10SIN and AS25F364MQ-10WIN

New 8Gb LPDDR4X SDRAM

The News: Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with a new LPDDR4X device featuring on-chip ECC. Offering an extension to the company’s fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

Part Numbers: AS4C256M32MD4V-062BAN

Key Specifications and Benefits:

  • On-chip ECC
  • AEC-Q100 qualified
  • Low-voltage operation of 6V/1.1V/1.8V
  • Fast clock speeds of 1.6GHz
  • Extremely high transfer rates of 3.2Gbps
  • -40°C to +105°C operating temperature range
  • Organized as two channels per device
    • Eight internal x16 banks per channel
  • Fully synchronous operation
  • Programmable read and write burst lengths of 16, 32, and on the fly
  • Selectable output drive strength
  • On-chip temperature sensor controls the self-refresh rate
  • Offered in the 200-ball FBGA package

Target Applications:

  • 5G, AI, and IoT
  • Portable electronics for the consumer, commercial, and industrial markets
  • Automotive ADAS systems

The Context: Offering an extension to Alliance Memory’s fourth-generation LPDDR4 SDRAMs, the company’s new 8Gb LPDDR4X device with on-chip ECC offers ~50% lower power consumption to increase battery life in portable electronics for the consumer, commercial, and industrial markets, including smart phones, smart speakers, and other IoT devices utilizing AI and 5G technologies. Providing increased efficiency for advanced audio and ultra-high-resolution video in embedded applications, the AS4C256M32MD4V-062BAN delivers fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications — including ADAS systems — the AEC-Q100 qualified device operates over a temperature range of -40°C to +105°C.

Alliance Memory’s LPDDR4X SDRAM provides a reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions in high-bandwidth, high-performance memory system applications — eliminating the need for costly redesigns and part requalification.

Availability: Samples and production quantities of the AS4C256M32MD4V-062BAN are available now, with lead times of 12 weeks.

Product Datasheet:
https://www.alliancememory.com/as4c256m32md4v/ (AS4C256M32MD4V-062BAN)

New 2Gb, 4Gb, and 8Gb LPDDR4 SDRAMs

The News: Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices featuring on-chip ECC. For improved performance with higher power efficiency than previous-generation LPDDR3 SDRAMs, the 2Gb AS4C128M16MD4-062BAN, 4Gb AS4C256M16MD4-062BAN and AS4C128M32MD4-062BAN, and 8Gb AS4C256M32MD4-062BAN offer lower power consumption and faster speeds in the 200-ball FBGA package.

Parts Table:

Part # Density Organization Speed Package
AS4C128M16MD4-062BAN 2Gb with ECC 128Mb x 16 1600MHz 200-ball FBGA (10mm x 14.5mm x 0.8mm)
AS4C256M16MD4-062BAN 4Gb with ECC 256Mb x 16 1600MHz 200-ball FBGA (10mm x 14.5mm x 0.8mm)
AS4C128M32MD4-062BAN 4Gb with ECC 128Mb x 32 1600MHz 200-ball FBGA (10mm x 14.5mm x 0.8mm)
AS4C256M32MD4-062BAN 8Gb with ECC 256Mb x 32 1600MHz 200-ball FBGA (10mm x 14.5mm x 1.1mm)

Key Specifications and Benefits:

  • On-chip ECC
  • AEC-Q100 qualified
  • Low-voltage operation of 1.1V/1.8V
  • Fast clock speeds of 1.6GHz
  • Extremely high transfer rates of 3.2Gbps
  • Automotive A2 Grade, temperature range -40°C to +105°C
  • Eight internal banks per channel
  • x32 for 2-channels per device (AS4C128M32MD4, AS4C256M32MD4)
  • x16 for 1-channel per device (AS4C128M16MD4, AS4C256M16MD4)
  • Programmable read and write latencies
  • Programmable and on-the-fly burst lengths (16 and 32)
  • Selectable output drive strength
  • On-chip temperature sensor to control self-refresh rate
  • Offered in the 200-ball FBGA package

Target Applications:

  • 5G, AI, and IoT
  • Portable electronics for the consumer and industrial markets
  • Automotive infotainment and ADAS systems

 The Context: Compared to previous-generation LPDDR3 SDRAMs, Alliance Memory’s new 2Gb, 4Gb, and 8Gb LPDDR4 devices with on-chip ECC offer lower power consumption to increase battery life in portable electronics for the consumer and industrial markets, including tablets, wearables, handheld gaming consoles, personal navigation systems, and more. Providing increased efficiency for advanced audio and high-resolution video in embedded applications, the AS4C128M16MD4-062BAN, AS4C256M16MD4-062BAN, AS4C128M32MD4-062BAN, and AS4C256M32MD4-062BAN deliver fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications — including infotainment and ADAS systems — the AEC-Q100 qualified devices operate over a temperature range of -40°C to +105°C.

With minimal die shrinks, Alliance Memory’s LPDDR4 SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions in high-bandwidth, high-performance memory system applications — eliminating the need for costly redesigns and part requalification.

Availability: Samples and production quantities of the new LPDDR4 SDRAMs are available now, with lead times of eight weeks.

Product Datasheet:

https://www.alliancememory.com/datasheets/as4C128m16md4/ (AS4C128M16MD4-062BAN, AS4C256M16MD4-062BAN, AS4C128M32MD4-062BAN, and AS4C256M32MD4-062BAN)

Extended Support for Micron 8G DDR3 SDRAMs

To all our valued distribution partners and customers,

Despite the challenges of 2020 — including the COVID-19 pandemic, U.S.-China trade war, and general global economic ambiguity — Alliance Memory has experienced remarkable growth this year. We would like to take this opportunity to thank each and every one of you for your efforts and support, which have been instrumental to our success.

Moving forward, we will continue to expand our portfolio with new and exciting products, along with creative partnerships with major companies like Micron. To that end, we’re proud to announce that we’re extending our agreement with Micron on its 8G DDR3 SDRAMs (monolithic part/single die) with continued support through 2021. Listed below, these exclusive products can only be found at Alliance Memory.

Part number
AS4C512M16D3L-12BCN
4C512M16D3L-12BCNTR
AS4C512M16D3L-12BIN
AS4C512M16D3L-12BINTR
MT41K512M16HA-107:A
MT41K512M16HA-107:ATR
MT41K512M16HA-125:A
MT41K512M16HA-125:ATR

Thanks again for your continued support,

Alliance Memory Management

Micron J3, P30, and P33 1.8V and 3V Parallel NOR Flash Available Direct From Alliance Memory

The News: Alliance Memory announces that the company is now an authorized reseller for Micron’s J3, P30, and P33 series of parallel NOR Flash devices, which Micron previously discontinued with product change notification #32163 (last time buy: March 2018). Micron is continuing to produce these devices for Alliance Memory and intends to only supply Alliance Memory for any new orders placed through mid-2021.

Parts Table:

Series Part number Density Block configuration Voltage Temperature range Package Check stock availability
J3 JS28F128J3F75A 128Mb Uniform Block Vcc/Q=2.7V~3.6V -40°C to 85°C 56-Lead TSOP Buy
PC28F128J3F75A 128Mb Uniform Block Vcc/Q=2.7V~3.6V -40°C to 85°C 64-ball BGA Buy
JS28F128J3F75B 128Mb Uniform Block Vcc/Q=2.7V~3.6V -40°C to 85°C 56-Lead TSOP Buy
JS28F640J3F75A 64Mb Uniform Block Vcc/Q=2.7V~3.6V -40°C to 85°C 56-Lead TSOP Buy
JS28F320J3F75A 32Mb Uniform Block Vcc/Q=2.7V~3.6V -40°C to 85°C 56-Lead TSOP Buy
P30 PC28F512P30BFB 512Mb Bottom Boot Vcc=1.7V~2.0V -40°C to 85°C 64-ball BGA Buy
PC28F640P30TF65A 64Mb Top Boot Vcc=1.7V~2.0V -40°C to 85°C 64-ball BGA Buy
PC28F640P30BF65B 64Mb Bottom Boot Vcc=1.7V~2.0V -40°C to 85°C 64-ball BGA Buy
P33 PC28F512P33BFD 512Mb Bottom Boot Vcc/Q=2.3V~3.6V -40°C to 85°C 64-ball BGA Buy
PC28F128P33BF60A 128Mb Bottom Boot Vcc/Q=2.3V~3.6V -40°C to 85°C 64-ball BGA Buy
JS28F128P33BF70A 128Mb Bottom Boot Vcc/Q=2.3V~3.6V -40°C to 85°C 56-Lead TSOP Buy
PC28F640P33BF60A 64Mb Bottom Boot Vcc/Q=2.3V~3.6V -40°C to 85°C 64-ball BGA Buy

Key Specifications and Benefits:

  • Single-bit cell (SBC) and multi-level cell (MLC) Flash manufactured on 65nm NOR technology
  • Advanced write protection mechanisms
  • x8 and x16 bus widths
  • Common flash interface (CFI) compatible
  • Access times down to 60ns
  • Operate over a -40°C to +85°C temperature range
  • Offered in 56-lead TSOP and 64-ball BGA packages

Target Applications:

  • Mobile phones, scientific instruments, medical devices, and many other commercial, industrial, and automotive applications

The Context: Alliance Memory is committed to meeting its customers’ legacy component needs and has had great success working with Micron to provide continued support for a variety of devices, including 512M SDRAMs, 8G DDR3L SDRAMs, and flash memory including the M29F, M45PE, and N25Q. The company is continuing that success with these J3, P30, and P33 NOR Flash parts, which will provide its customers with a steady supply for a minimum of two more years.

Availability: Samples and production quantities of the Micron J3, P30, and P33 1.8V and 3V parallel NOR Flash devices are available now.

Product Datasheets:
https://www.alliancememory.com/wp-content/uploads/pdf/flash/Datasheet/J3_Series_datasheet.pdf (J3 series)
https://www.alliancememory.com/wp-content/uploads/pdf/flash/Datasheet/P30-64M-Datasheet.pdf (P30 series, 64Mb)
https://www.alliancememory.com/wp-content/uploads/pdf/flash/Datasheet/P30-512M-Datasheet.pdf (P30 series, 512Mb)
https://www.alliancememory.com/wp-content/uploads/pdf/flash/Datasheet/P33-64M_128M_Datasheet.pdf (P33 series, 64Mb and 128Mb)
https://www.alliancememory.com/wp-content/uploads/pdf/flash/Datasheet/P33-512M_Datasheet.pdf (P33 series, 512Mb)