Customers who need CY62256 series devices, for which Cypress Semiconductor Corporation issued a product termination notification with a last-time buy date of July 4, 2018, should be advised that direct replacements are available from Alliance Memory with short lead times. [Read more]
New Product Announcements
Low-Power SDRAMs in a Wide Range of Densities and Package Options
Alliance Memory’s SDRAM portfolio now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices. [Read more]
New 256Mb High-Speed CMOS SDRAMs
More 256Mb high-speed CMOS SDRAMs with new x8 and x4 devices in the 54-pin 400-mil plastic TSOP II… [Read more]
New 64Mb Low-Power SRAM
Alliance Memory introduces a new 64Mb (4M x 16 bit) device in 48‑pin, 12mm by 20mm TSOP-I and 48-ball TFBGA packages. [Read more]
New 512Mb (x8 and x16) DDR3 and DDR3L SDRAMs
Expanding the industry’s widest offering of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs… [Read more]
New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs
The News: To address the memory market’s shortage of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs, Alliance Memory announces a new die revision (B die) for its 2Gb and 4Gb devices in the 96-ball FBGA package. Part Numbers: AS4C128M16D3B-12BCN, AS4C128M16D3LB-12BCN, AS4C256M16D3B-12BCN, AS4C256M16D3LB-12BCN, and AS4C256M16D3LB-12BIN Availability: Alliance Memory keeps the B die DDR3 and DDR3L SDRAMs […]
